Alloy for those processes, aplications and sectors where Pb use is allowed. Sn-Pb based alloys guarantee a high degree of fluidity, an optimal union in the soldering of electronic components and a low melting point.
Composition (%):
Sn: 61,5-62,5
Pb: Rest
Ag: 1,8-2,2
Cu: Max 0,08
Formats:
Ingot
Anode
Shot