Alloy for those processes, aplications and sectors where Pb use is allowed. Sn-Pb based alloys guarantee a high degree of fluidity, an optimal union in the soldering of electronic components and a low melting point.
Composition (%):
Sn: 39,5-40,5
Pb: Rest
Ag: Max 0,1
Cu: Max 0,08
Formats:
Ingot
Anode
Shot