Tin-based eutectic alloy with copper, nickel and a small addition of germanium. Alloy patented by NIHON SUPERIOR®(Japan), Estaños y Soldaduras Senra obtained the licence to manufacture this alloy and its corresponding leveling alloys. This alloy is characterised by a fluidity and wettability similar to SnPb and it can be used in wave, HASL, selective or manual soldering processes. The addition of nickel reduces the growth of the Cu6Sn5 intermetalic and thus increases the soldering ductility. It also improves the mechanical and metallurgical properties, increasing its fluidity and wettability, reducing the copper dissolution and ensuring the integrity and morphology of the intermetallic. The micro-addition of germanium acts as an antioxidant, thereby reducing the dross formation and the tarnish, as well as working as a surfactant, improving the fluidity of the alloy.