Alloy for those processes, aplications and sectors where Pb use is allowed. Sn-Pb based alloys guarantee a high degree of fluidity, an optimal union in the soldering of electronic components and a low melting point.
Composition (%):
Sn: 4,85-5,2
Pb: Rest
Ag: 1,25-1,8
Cu: Max 0,08
Formats:
Ingot
Anode
Shot